封装结构采用新的“无管脚”网格阵列技术和真空井工艺，提供更高的可靠性和电路密度

1989 Proceedings of the IEEE Custom Integrated Circuits Conference Pub Date : 1989-05-15 DOI:10.1109/CICC.1989.56751

Patrick O. Nunally

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引用次数: 1

摘要

一种创新技术，可产生更高的VLSI/VHSIC封装密度和可靠性，同时满足军事要求，包括可焊性和可检查性。这种方法被称为无管脚网格阵列(PLGA)技术。对其可靠性进行了检验，并简要讨论了其提高电子系统辐射硬度的能力

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Packaging structures utilizing new `pinless' grid array technologies and vacuum well processes to provide enhanced reliability and circuit densities

An innovative technology that yields greater VLSI/VHSIC packaging densities and reliability while meeting military requirements including solderability and inspectability. The approach is called pinless grid array (PLGA) technology. Its reliability is examined, and its capability for increasing radiation hardness of electronic systems is briefly discussed

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来源期刊

1989 Proceedings of the IEEE Custom Integrated Circuits Conference

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