基于HfOx和TaOx的RRAM的持久性/留存率权衡

M. Azzaz, E. Vianello, B. Sklénard, P. Blaise, A. Roule, C. Sabbione, S. Bernasconi, C. Charpin, C. Cagli, E. Jalaguier, S. Jeannot, S. Denorme, P. Candelier, M. Yu, L. Nistor, C. Fenouillet-Béranger, L. Perniola
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引用次数: 26

摘要

本文比较了TiN/HfO2/Ti/TiN和TiN/Ta2O5/TaOx/TiN存储堆栈的存储性能。首先,研究了双极开关参数和顺应电流对记忆窗口和持久时间的影响。然后比较了在给定工作电流(100μA)下的持久性能和数据保持性能。基于Ta2O5的内存堆栈具有更好的内存窗口(20年)和数据保留性能,而基于HfO2的内存堆栈具有良好的持久性能(108周期)。最后,利用密度泛函理论从头计算,研究了HfOx和TaOx介质中导电丝的稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Endurance/Retention Trade Off in HfOx and TaOx Based RRAM
In this paper the memory performances of the TiN/HfO2/Ti/TiN and TiN/Ta2O5/TaOx/TiN memory stacks are compared. First, the bipolar switching parameters and the effect of the compliance current on the memory window and endurance are investigated. Then, the endurance and data retention properties are compared at a given operating current (100μA). Ta2O5 based memory stack exhibits a better memory window (2 decades) and data retention, while the HfO2 one shows good endurance properties (108 cycles). Finally, thanks to ab initio calculations using Density Functional Theory, the stability of the conductive filament is investigated in both HfOx and TaOx dielectrics.
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