利用电压斜坡和氮后向散射技术对硅中生成杂质进行氩离子植入损伤捕集

B. Golja, A. G. Nassibian
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引用次数: 7

摘要

本文研究了应用于mos电容器的线性电压坡道对ar离子注入吸光的影响。与对照样品(未注入)进行了比较,并利用N+离子卢瑟福后向散射检测了受损层对生成杂质的沉淀。在950°C?结果表明,较长的退火时间和较高的退火温度对少数载流子寿命都有不利影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ar ion implant damage gettering of generation impurities in silicon employing voltage ramping and nitrogen backscattering
The effects of Ar-ion implant gettering has been investigated using the linear voltage ramp applied to m.o.s. capacitors. A comparison is made with control (not implanted) samples and N+-ion Rutherford backscattering is used to examine the precipitation of generation impurities by the damaged layers. The gettering anneals were carried out over the temperature range 950°C?1100°C and for various times from 15 min to 120 min. It is shown that long gettering anneal times and high anneal temperatures both have a detrimental effect on minority-carrier lifetime.
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