直接芯片连接(DCA)封装的二维热流传感器

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI:10.1109/ICEPT.2007.4441487

G. Shen, Jian Wu, Hua Zhang, M. Qin, Qing-An Huang

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引用次数: 15

摘要

本文介绍了一种DCA封装式热流传感器的设计和制作，以及仿真和测试结果。将制作好的流量传感器用胶粘剂粘在PCB板的背面，导线通过预制孔粘接在PCB板的正面，然后在正面用隔热树脂封装芯片。试验结果与预测值吻合较好，误差不超过8%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor

The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.

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来源期刊

2007 8th International Conference on Electronic Packaging Technology

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