{"title":"未经优化的电子封装电路模型参数提取","authors":"Luc Martens, S. Sercu","doi":"10.1109/EPEP.1999.819196","DOIUrl":null,"url":null,"abstract":"In this paper, we derive circuit models for electronic packages starting from Z- or Y-matrix descriptions. If we propose a T- or a /spl Pi/-circuit, a direct relation is found between the admittance and impedance values and the circuit parameters. No optimization is needed. The T- and /spl Pi/-circuit models are valid for a general class of interconnections and packages. We illustrate the method on an example of a TAB interconnection structure.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Parameter extraction for circuit models of electronic packages without optimization\",\"authors\":\"Luc Martens, S. Sercu\",\"doi\":\"10.1109/EPEP.1999.819196\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we derive circuit models for electronic packages starting from Z- or Y-matrix descriptions. If we propose a T- or a /spl Pi/-circuit, a direct relation is found between the admittance and impedance values and the circuit parameters. No optimization is needed. The T- and /spl Pi/-circuit models are valid for a general class of interconnections and packages. We illustrate the method on an example of a TAB interconnection structure.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"63 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819196\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819196","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Parameter extraction for circuit models of electronic packages without optimization
In this paper, we derive circuit models for electronic packages starting from Z- or Y-matrix descriptions. If we propose a T- or a /spl Pi/-circuit, a direct relation is found between the admittance and impedance values and the circuit parameters. No optimization is needed. The T- and /spl Pi/-circuit models are valid for a general class of interconnections and packages. We illustrate the method on an example of a TAB interconnection structure.