冷凝热成像——一种定位半导体芯片短路和测定表面温度的新方法

A. Dermarderosian, V. Gionet, V. Caccamesi
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引用次数: 1

摘要

介绍了一种简单、廉价的半导体芯片短路/热点定位和表面温度测量技术。该技术涉及到在半导体芯片表面上发生液体蒸发(短路/热点)或气体冷凝(表面温度)的点的视觉观察。一个16毫米的电影胶片生动地展示了这些效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Condensation Thermography - A Novel Approach for Locating Short Circuits and Determing Surface Temperatures in Semiconductor Die
A simple and inexpensive technique for locating shorts/hot spots and measuring surface temperatures of semiconductor die is described and detailed with some examples. The technique involves the visual observation of the point at which liquid evaporation (shorts/hot spots) or gaseous condensation (surface temperature) occurs on the surface of the semiconductor die. A 16 mm motion picture film has been made which vividly demonstrates these effects.
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