Finite element stress analysis of thin die detachment process

One of the major developments in high-density electronic packaging assembly processes is the capability of handling very thin semiconductor devices. In order to achieve high production yield in the assembly processes and high reliability for the final packages, careful study on the handling method of very thin dice is therefore needed. In this article, we focus on the die detachment process of very thin dice in the die bonding process. Both 2D and 3D finite element models are built to simulate the die detachment process of a thin die, which is adhered to a plastic adhesive film. We report the stress distribution of the die when it is subjected to a displacement load by multiple push-up pins.