MLCC绝缘电阻下降原因分析

Wei Jiang, Yongda Hu, S. Bao, Song Lijie, Zheng Yuwei, Yongqiang Cui, Li Qiang
{"title":"MLCC绝缘电阻下降原因分析","authors":"Wei Jiang, Yongda Hu, S. Bao, Song Lijie, Zheng Yuwei, Yongqiang Cui, Li Qiang","doi":"10.1109/ICEPT.2015.7236807","DOIUrl":null,"url":null,"abstract":"In this paper, based on the results of SEM and EDS analysis, I would like to share the discovery of MLCC failure due to insulation resistance. For external factors, The defects which caused by mechanical stress can lead to lack of insulation resistance. For the intrinsic factors, MLCC insulation resistance failure is due to the presence of defects, and the main defects include void in ceramic dielectric and delamination of porcelain body and inner electrode. These defects are difficult to analyze. With the help of SEM electron microscope detection, these defets can be see. The reason is the poor control of sintering process.In the test,these defects will cause the capacitor quickly form a conductive channel, finally lead to insulation resistance failure.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Analysis on the causes of decline of MLCC insulation resistance\",\"authors\":\"Wei Jiang, Yongda Hu, S. Bao, Song Lijie, Zheng Yuwei, Yongqiang Cui, Li Qiang\",\"doi\":\"10.1109/ICEPT.2015.7236807\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, based on the results of SEM and EDS analysis, I would like to share the discovery of MLCC failure due to insulation resistance. For external factors, The defects which caused by mechanical stress can lead to lack of insulation resistance. For the intrinsic factors, MLCC insulation resistance failure is due to the presence of defects, and the main defects include void in ceramic dielectric and delamination of porcelain body and inner electrode. These defects are difficult to analyze. With the help of SEM electron microscope detection, these defets can be see. The reason is the poor control of sintering process.In the test,these defects will cause the capacitor quickly form a conductive channel, finally lead to insulation resistance failure.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236807\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236807","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

在本文中,基于SEM和EDS分析的结果,我想分享由于绝缘电阻导致MLCC失效的发现。对于外部因素,机械应力引起的缺陷会导致绝缘电阻的缺乏。内在因素方面,MLCC绝缘电阻失效是由于缺陷的存在,主要缺陷包括陶瓷介电介质的空隙、瓷体和内电极的分层。这些缺陷很难分析。借助扫描电镜检测,可以看到这些缺陷。原因是烧结工艺控制不好。在测试中,这些缺陷会导致电容器迅速形成导电通道,最终导致绝缘电阻失效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis on the causes of decline of MLCC insulation resistance
In this paper, based on the results of SEM and EDS analysis, I would like to share the discovery of MLCC failure due to insulation resistance. For external factors, The defects which caused by mechanical stress can lead to lack of insulation resistance. For the intrinsic factors, MLCC insulation resistance failure is due to the presence of defects, and the main defects include void in ceramic dielectric and delamination of porcelain body and inner electrode. These defects are difficult to analyze. With the help of SEM electron microscope detection, these defets can be see. The reason is the poor control of sintering process.In the test,these defects will cause the capacitor quickly form a conductive channel, finally lead to insulation resistance failure.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信