数字电路动态热测试的可行性分析

Proceedings Sixth Asian Test Symposium (ATS'97) Pub Date : 1997-11-17 DOI:10.1109/ATS.1997.643951

J. Altet, A. Rubio, H. Tamamoto

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引用次数: 5

摘要

温度可以用作测试观察:当激活时，一些故障会产生局部功耗增加，改变IC的表面热图，可通过内置热传感器检测到。本文对该测试技术的可行性和具体测试模式的生成进行了讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Analysis of the feasibility of dynamic thermal testing in digital circuits

Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with built-in thermal sensors. In this work, both the feasibility of this testing technique and the generation of the specific test pattern are discussed.

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Proceedings Sixth Asian Test Symposium (ATS'97)

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