用于倒装芯片的1024针塑料球栅阵列

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367655

A. Switky, V. Sajja, J. Darnauer, W. Dai

{"title":"用于倒装芯片的1024针塑料球栅阵列","authors":"A. Switky, V. Sajja, J. Darnauer, W. Dai","doi":"10.1109/ECTC.1994.367655","DOIUrl":null,"url":null,"abstract":"Described in this paper is a 1024-pin ball grid array package (BGA) that contains an area array die flip-chip mounted to a silicon transposer. The transposer, which fans the area array to two rows of pads on its periphery, is wire bonded to a printed circuit board substrate. Mechanical and electrical design considerations of the BGA are discussed, as well as the results of SPICE models.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 1024-pin plastic ball grid array for flip chip die\",\"authors\":\"A. Switky, V. Sajja, J. Darnauer, W. Dai\",\"doi\":\"10.1109/ECTC.1994.367655\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Described in this paper is a 1024-pin ball grid array package (BGA) that contains an area array die flip-chip mounted to a silicon transposer. The transposer, which fans the area array to two rows of pads on its periphery, is wire bonded to a printed circuit board substrate. Mechanical and electrical design considerations of the BGA are discussed, as well as the results of SPICE models.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367655\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367655","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文描述了一种1024针球栅阵列封装(BGA)，它包含一个安装在硅转座上的区域阵列芯片倒装芯片。所述转座，其将所述区域阵列扇成其外围的两排焊盘，是用导线粘合到印刷电路板基板上的。讨论了BGA的机械和电气设计考虑因素，以及SPICE模型的结果

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A 1024-pin plastic ball grid array for flip chip die

Described in this paper is a 1024-pin ball grid array package (BGA) that contains an area array die flip-chip mounted to a silicon transposer. The transposer, which fans the area array to two rows of pads on its periphery, is wire bonded to a printed circuit board substrate. Mechanical and electrical design considerations of the BGA are discussed, as well as the results of SPICE models.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

1994 Proceedings. 44th Electronic Components and Technology Conference

自引率

0.00%

发文量