基于表面活化键合的光学多芯片三维集成高密度微系统封装

E. Higurashi, D. Chino, T. Suga, R. Sawada
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引用次数: 1

摘要

多芯片的三维混合集成是实现高功能、紧凑的光电微系统的重要技术。本研究利用Au-Au表面活化键合(键合温度150℃)成功实现了光学芯片的三维集成。所制备的微系统由两个元素组成:i)一个微加工硅光学平台,包含一个键合激光二极管、微镜和通孔电极;以及ii)包含键合光电二极管、电互连和折射微透镜的玻璃基板。采用表面活化键合的方法将硅光学平台与玻璃基板垂直堆叠。完全集成微系统的尺寸仅为2.6 mm × 2.6 mm × 1mm厚。设计和制造过程允许芯片级和晶圆级封装。此外,还讨论了激光多普勒测速传感器的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging
The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150degC). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm times 2.6 mm times 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.
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