一个0.13-/spl μ /m节点的串扰延迟分析测试芯片和精确门级仿真技术

Y. Sasaki, M. Satoh, M. Kuramoto, F. Kikuchi, T. Kawashima, H. Masuda, K. Yano
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引用次数: 1

摘要

通过测量采用0.13-/spl mu/m节点技术制造的测试芯片,研究了串扰对延迟的影响。这项研究揭示了精确和快速的门级仿真技术的三个要求:(1)考虑依赖于大范围内相对信号到达时间的退化变化,(2)基于静态时序分析(STA)的操作,以及(3)定量估计由多个侵略者引起的退化积累。提供了这种仿真技术的候选方案。并通过测量和仿真验证了其高精度特性。在具有双干扰源串扰的测试结构中,测量和模拟退化之间的最大误差减小到传统方法的六分之一以下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Crosstalk delay analysis of a 0.13-/spl mu/m-node test chip and precise gate-level simulation technology
The impact of crosstalk on the delay was examined by measuring a test chip manufactured with a 0.13-/spl mu/m-node technology. This examination revealed three requirements for precise and fast gate-level simulation technology: (1) consideration of degradation change dependent on relative-signal-arrival-time over a wide range, (2) static timing analysis (STA) based operation, and (3) quantitative estimation of the degradation accumulation caused by multiple aggressors. A candidate for such simulation technology is provided. and its highly precise characteristic is demonstrated through measurements and simulations. In a test structure with a two-aggressor crosstalk, the maximum error between the measured and simulated degradations was reduced to less than one sixth of that with a conventional method.
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