新型CMP技术控制氮的去除率

T. Shinoda, A. Endou, K. Sugai
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引用次数: 0

摘要

提出了一个新的模型来控制化学添加剂对SiN的去除率(RR),这些化学添加剂具有(1)接近SiN底物并吸附在其上的功能,以及(2)与SiN底物反应并改变Si - N键强度的功能。利用计算化学的方法对这些函数进行了验证,并计算了SiN的模型RR的比值。这些比率与SiN的实验RR一致,证明了我们的新模型的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel CMP technology for removal rate control of SiN
A novel model was proposed to control the removal rate (RR) for SiN with chemical additives having (1) the functions to approach to the SiN substrate and to adsorb on it and (2) the functions to react with the SiN substrate and to change the strength of Si – N bonds. By using the computational chemistry methods, these functions were justified, and the ratios of the model RR for SiN were also calculated. These ratios were in agreement with those of the experimental RR for SiN, which demonstrated the validity of our novel model.
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