应用于MEMS传感器的新型硅谐振腔二阶应力隔离的研究

Jing Zhang, Yagang Wang, Yudong Liu, Chen Lin, Z. Yao, Yan Su, Peiwen Xu
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引用次数: 2

摘要

本文研究了温度变化时微电子机械系统(MEMS)谐振腔的应力分布和谐振频率变化。为了解决这一问题,提出了一种新的二阶应力隔离框架。通过有限元分析和三种样机的试验,验证了二阶应力隔离框架对环境温度具有良好的适应性,其频率温度系数(TCf)从-1011ppm/°C降至-99.5 ppm/°C。但是这种框架在一定程度上损害了设备的灵敏度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Study of A Novel Second-order Stress Isolation for Silicon Resonator Applied on MEMS Sensor
This paper studied the stress distribution and resonant frequency variation of the Micro Electro Mechanical System (MEMS) resonator when temperature varies. To address this problem, a novel second-order stress isolation frame had been proposed. By finite element analysis and the tests of three kind of prototypes, it was verified that the second-order stress isolation frame showed a good adaptability of the ambient temperature, and its temperature coefficient of frequency (TCf) was reduced from -1011ppm/°C to -99.5 ppm/°C. However, this kind of frame damaged the sensitivity of device to a certain extent.
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