低温焊料和模具贴附材料的物理性能

G. González, Yanqing Liu, S. Maganti
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引用次数: 6

摘要

分析了几种电子封装常用焊料在-55 ~ 180℃温度范围内的力学性能(弹性模量、屈服点、极限抗拉强度、蠕变)和物理性能(微观结构和热膨胀系数)。许多实验方法被使用并相互关联。采用有限元法对热膨胀失配系数引起的热应力(热疲劳)进行了模拟。本文介绍了一些初步的数据,并结合我们在实验室中获得的有关金-锡共晶合金的数据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical properties of low temperature solders and die attach materials
The properties at the temperature range of -55/spl deg/C to 180/spl deg/C of several common solders used in electronic packaging are analyzed for mechanical properties (elastic modulus, yield point, ultimate tensile strength (UTS), and creep) and physical properties (microstructure and thermal expansion coefficient). Numerous experimental methods are utilized and correlated. The finite element method is used to model thermal stresses (thermal fatigue) induced by the mismatched coefficient of thermal expansion using all the results obtained in this work. Some preliminary data are presented together with previous data obtained in our laboratories for the Au-Sn eutectic alloy.
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