{"title":"低温焊料和模具贴附材料的物理性能","authors":"G. González, Yanqing Liu, S. Maganti","doi":"10.1109/SOUTHC.1995.516127","DOIUrl":null,"url":null,"abstract":"The properties at the temperature range of -55/spl deg/C to 180/spl deg/C of several common solders used in electronic packaging are analyzed for mechanical properties (elastic modulus, yield point, ultimate tensile strength (UTS), and creep) and physical properties (microstructure and thermal expansion coefficient). Numerous experimental methods are utilized and correlated. The finite element method is used to model thermal stresses (thermal fatigue) induced by the mismatched coefficient of thermal expansion using all the results obtained in this work. Some preliminary data are presented together with previous data obtained in our laboratories for the Au-Sn eutectic alloy.","PeriodicalId":341055,"journal":{"name":"Proceedings of Southcon '95","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Physical properties of low temperature solders and die attach materials\",\"authors\":\"G. González, Yanqing Liu, S. Maganti\",\"doi\":\"10.1109/SOUTHC.1995.516127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The properties at the temperature range of -55/spl deg/C to 180/spl deg/C of several common solders used in electronic packaging are analyzed for mechanical properties (elastic modulus, yield point, ultimate tensile strength (UTS), and creep) and physical properties (microstructure and thermal expansion coefficient). Numerous experimental methods are utilized and correlated. The finite element method is used to model thermal stresses (thermal fatigue) induced by the mismatched coefficient of thermal expansion using all the results obtained in this work. Some preliminary data are presented together with previous data obtained in our laboratories for the Au-Sn eutectic alloy.\",\"PeriodicalId\":341055,\"journal\":{\"name\":\"Proceedings of Southcon '95\",\"volume\":\"60 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Southcon '95\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOUTHC.1995.516127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Southcon '95","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1995.516127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Physical properties of low temperature solders and die attach materials
The properties at the temperature range of -55/spl deg/C to 180/spl deg/C of several common solders used in electronic packaging are analyzed for mechanical properties (elastic modulus, yield point, ultimate tensile strength (UTS), and creep) and physical properties (microstructure and thermal expansion coefficient). Numerous experimental methods are utilized and correlated. The finite element method is used to model thermal stresses (thermal fatigue) induced by the mismatched coefficient of thermal expansion using all the results obtained in this work. Some preliminary data are presented together with previous data obtained in our laboratories for the Au-Sn eutectic alloy.