{"title":"全会演讲 1P1:通过全球价值链整合缩短产品上市时间","authors":"Drew Gude","doi":"10.1109/ISQED.2008.181","DOIUrl":null,"url":null,"abstract":"Summary form only given. The product development challenges for high-tech companies are even greater than most industries, thanks in large part to their dependence on an increasingly distributed and complex global value chain and extreme pressure to deliver innovation to market quicker than their fierce competition.That chain of frequently independent companies collaborating on these shrinking project timeline stretches from product conception to chip design, product development, production/assembly, testing, packaging, and delivery. Central to addressing these challenges are solutions and interoperable IT enterprise architectures that can streamline this innovation pipeline. In this presentation the author discusses the opportunities to shrink product time-to-market by more quickly, efficiently, and securely collaborating and integrating with product development value chain partners.","PeriodicalId":243121,"journal":{"name":"9th International Symposium on Quality Electronic Design (isqed 2008)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Plenary Speech 1P1: Shrinking time-to-market through global value chain integration\",\"authors\":\"Drew Gude\",\"doi\":\"10.1109/ISQED.2008.181\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. The product development challenges for high-tech companies are even greater than most industries, thanks in large part to their dependence on an increasingly distributed and complex global value chain and extreme pressure to deliver innovation to market quicker than their fierce competition.That chain of frequently independent companies collaborating on these shrinking project timeline stretches from product conception to chip design, product development, production/assembly, testing, packaging, and delivery. Central to addressing these challenges are solutions and interoperable IT enterprise architectures that can streamline this innovation pipeline. In this presentation the author discusses the opportunities to shrink product time-to-market by more quickly, efficiently, and securely collaborating and integrating with product development value chain partners.\",\"PeriodicalId\":243121,\"journal\":{\"name\":\"9th International Symposium on Quality Electronic Design (isqed 2008)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-03-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"9th International Symposium on Quality Electronic Design (isqed 2008)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2008.181\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"9th International Symposium on Quality Electronic Design (isqed 2008)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2008.181","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
仅提供摘要形式。高科技公司在产品开发方面面临的挑战甚至比大多数行业都要大,这在很大程度上要归功于它们对日益分散和复杂的全球价值链的依赖,以及比激烈的竞争对手更快将创新产品推向市场的巨大压力。要应对这些挑战,关键在于能够简化创新流程的解决方案和可互操作的 IT 企业架构。在本演讲中,作者将讨论通过更快速、高效、安全地与产品开发价值链合作伙伴协作和集成,缩短产品上市时间的机会。
Plenary Speech 1P1: Shrinking time-to-market through global value chain integration
Summary form only given. The product development challenges for high-tech companies are even greater than most industries, thanks in large part to their dependence on an increasingly distributed and complex global value chain and extreme pressure to deliver innovation to market quicker than their fierce competition.That chain of frequently independent companies collaborating on these shrinking project timeline stretches from product conception to chip design, product development, production/assembly, testing, packaging, and delivery. Central to addressing these challenges are solutions and interoperable IT enterprise architectures that can streamline this innovation pipeline. In this presentation the author discusses the opportunities to shrink product time-to-market by more quickly, efficiently, and securely collaborating and integrating with product development value chain partners.