硅基LPcvd Si/sub 3/N/sub 4/ SiO/sub 2/薄膜驻极体的性质

Mingzhou Zhao, Zhiqiang Huang, LinZhuang Sha, Zhen Xu
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引用次数: 2

摘要

采用LPcvd和热氧化技术在不同掺杂的硅片上制备了Si/sub 3/N/sub 4//SiO/sub 2/双层驻极体薄膜。实验结果表明,HMDS修饰后的Si/sub 3/N/sub 4//SiO/sub 2/双层膜具有良好的负电荷存储能力,且所有的负电荷几乎都被捕获在上层Si/sub 3/N/sub 4/薄膜中。此外,Si/sub 3/N/sub 4//SiO/sub 2/薄膜的TSD光谱受硅片中掺杂剂的差异影响较大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The properties of LPcvd Si/sub 3/N/sub 4//SiO/sub 2/ film electret based on silicon
By means of the technology of LPcvd and thermal oxidation the Si/sub 3/N/sub 4//SiO/sub 2/ double-layer electret film was prepared on different doped silicon wafers. The experimental results show that the Si/sub 3/N/sub 4//SiO/sub 2/ double-layer film possesses a good storage ability of negative charges after modifying the surface with HMDS, and all of the charges were almost trapped in the bulk of upper layer Si/sub 3/N/sub 4/ film. In addition, the TSD spectra of Si/sub 3/N/sub 4//SiO/sub 2/ film were influenced greatly by the differences of the dopants in the silicon wafers.
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