部件和封装结构功能的物理解释和数值近似

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. Pub Date : 2005-03-15 DOI:10.1109/STHERM.2005.1412171

L. Codecasa, D. D’Amore, P. Maffezzoni

{"title":"部件和封装结构功能的物理解释和数值近似","authors":"L. Codecasa, D. D’Amore, P. Maffezzoni","doi":"10.1109/STHERM.2005.1412171","DOIUrl":null,"url":null,"abstract":"A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"133 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Physical interpretation and numerical approximation of structure functions of components and packages\",\"authors\":\"L. Codecasa, D. D’Amore, P. Maffezzoni\",\"doi\":\"10.1109/STHERM.2005.1412171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"133 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 10

摘要

证明了单端口无源分布式热网络的结构函数与元件和封装内部热性能的空间分布之间的一种新的关系。提出了一种新的三对角化方法来逼近单端口分布集总热网络的结构函数。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Physical interpretation and numerical approximation of structure functions of components and packages

A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.

自引率

0.00%

发文量