{"title":"电子封装中通孔相互作用的等效电路模型","authors":"Yuzhe Chen, Zhonghua Wu, Yaowu Liu, J. Fang","doi":"10.1109/ISEMC.1994.385628","DOIUrl":null,"url":null,"abstract":"This paper presents the SPICE-type of equivalent circuit models for via interactions between conducting planes. These equivalent circuit models are derived from the radial transmission line theory. Transient simulation results from SPICE with our models are in excellent agreement with those from the inverse Fourier transformation of frequency domain solutions. These models can be used in various applications, such as the simulation of Delta-I noise in electronics packaging.<<ETX>>","PeriodicalId":154914,"journal":{"name":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Equivalent circuit models of via interactions in electronics packaging\",\"authors\":\"Yuzhe Chen, Zhonghua Wu, Yaowu Liu, J. Fang\",\"doi\":\"10.1109/ISEMC.1994.385628\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the SPICE-type of equivalent circuit models for via interactions between conducting planes. These equivalent circuit models are derived from the radial transmission line theory. Transient simulation results from SPICE with our models are in excellent agreement with those from the inverse Fourier transformation of frequency domain solutions. These models can be used in various applications, such as the simulation of Delta-I noise in electronics packaging.<<ETX>>\",\"PeriodicalId\":154914,\"journal\":{\"name\":\"Proceedings of IEEE Symposium on Electromagnetic Compatibility\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.1994.385628\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1994.385628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Equivalent circuit models of via interactions in electronics packaging
This paper presents the SPICE-type of equivalent circuit models for via interactions between conducting planes. These equivalent circuit models are derived from the radial transmission line theory. Transient simulation results from SPICE with our models are in excellent agreement with those from the inverse Fourier transformation of frequency domain solutions. These models can be used in various applications, such as the simulation of Delta-I noise in electronics packaging.<>
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