利用热压键合技术实现InP激光器与SOI波导的混合集成

2008 5th IEEE International Conference on Group IV Photonics Pub Date : 2008-10-07 DOI:10.1109/GROUP4.2008.4638097

M. Kapulainen, S. Ylinen, T. Aalto, M. Harjanne, K. Solehmainen, J. Ollila, V. Vilokkinen

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引用次数: 26

摘要

证明了InP激光器与4 μ m厚SOI波导的热压键合。良好的水平对齐是通过使用主动对齐来实现的。通过使用易于控制的制造过程，达到了优异的被动垂直对准。

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Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding

Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.

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2008 5th IEEE International Conference on Group IV Photonics

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