{"title":"铝箔包装(FPAC):一种新的包装概念","authors":"Y. Hotta, H. Sigyo, S. Kondo, S. Oizumi","doi":"10.1109/ECTC.1996.550896","DOIUrl":null,"url":null,"abstract":"This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Foil covered PACkage (FPAC): a new package concept\",\"authors\":\"Y. Hotta, H. Sigyo, S. Kondo, S. Oizumi\",\"doi\":\"10.1109/ECTC.1996.550896\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.550896\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.550896","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Foil covered PACkage (FPAC): a new package concept
This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield.
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