印刷线路板和组件的非清洁焊接技术的评估分析

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI:10.1109/ISEE.1995.514959

R. Ciocci

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引用次数: 1

摘要

虽然非清洁技术确实减少了对环境的不利影响，但必须考虑它们对产品可靠性的影响。选择改用非清洁材料和工艺的制造商需要保证产品性能不会受到不利影响。环境影响、制造能力和产品可靠性都是材料和工艺选择方法的有效标准。

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Evaluative analysis of no-clean soldering technologies for printed wiring boards and assemblies

While no-clean technologies do reduce adverse environmental impact, their effect on product reliability must be considered. Manufacturers who choose to convert to no-clean materials and processes need assurance that product performance is not adversely affected. Environmental effect, manufacturing capability, and product reliability are all valid criteria for a materials and process selection method.

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Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)

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