在100mm InP衬底上的0.1 μm pt下凹栅InP HEMT低噪声放大器的高可靠性性能

Y. Chou, D. Leung, M. Biedenbender, D. Eng, D. Buttari, X. Mei, C. H. Lin, R. Tsai, R. Lai, M. Barsky, M. Wojtowicz, A. Oki, T. Block
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引用次数: 3

摘要

在100 mm InP衬底上制备了0.1 μm pt凹陷InP HEMT低噪声放大器,在240、255和270°C的Tchannel下进行了加速温度寿命测试。在35 GHz时,基于ΔS21 <−1 dB对可靠性性能进行评估。寿命测试结果显示,在125°C的Tchannel下,活化能约为1.8 eV,寿命预测的可靠性为99%,置信度为90%,超过1×108小时。在100mm InP衬底上的0.1 μm pt下凹栅InP HEMT低噪声放大器的高可靠性演示对于需要高可靠性性能的先进军事/空间应用至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High reliability performance of 0.1-μm Pt-sunken gate InP HEMT low-noise amplifiers on 100 mm InP substrates
Accelerated temperature lifetesting at Tchannel of 240, 255, and 270 °C was performed on 0.1-μm Pt-sunken InP HEMT low-noise amplifiers fabricated on 100 mm InP substrates. The reliability performance was evaluated based on ΔS21 < −1 dB at 35 GHz. The lifetesting results exhibit activation energy of approximately 1.8 eV and lifetime projection of 99% reliability and 90% confidence exceeds 1×108 hours at Tchannel of 125 °C. The high reliability demonstration of 0.1-μm Pt-sunken gate InP HEMT low-noise amplifiers on 100 mm InP substrates is essential for advanced military/space applications requiring high reliability performance.
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