通孔安装连接器模型的电磁域分解

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI:10.1109/EPEPS47316.2019.193205

G. Hernández‐Sosa, Se-jung Moon, X. Ye

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引用次数: 0

摘要

在这项工作中，我们应用电磁域分解(EDD)将通孔安装(THM)连接器模型分为两个子域:连接器体和PCB部分。首先对各子域模型进行仿真，然后将各子域模型进行连接，得到连接器的整体响应。通过对比全域模型和串联模型对应的s参数和时域阻抗曲线进行频域和时域验证，获得了较好的相关结果。

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Electromagnetic Domain Decomposition for Through-Hole Mounting Connectors Models

In this work, we apply electromagnetic domain decomposition (EDD) to separate through-hole mounting (THM) connector models into two sub-domains: the connector body and the PCB section. The sub-domain models were simulated and then concatenated in order to get the whole connector response. Frequency and time-domain validation was performed by comparing the S-parameters and time-domain impedance profile corresponding to full-domain and concatenated models respectively, obtaining excellent correlation results.

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来源期刊

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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