用于传感器网络的超低功耗VCSEL的封装和特性

S. Sohr, D. Fischer, R. Rieske, K. Nieweglowski, K. Wolter
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引用次数: 0

摘要

本文对电耗低于5mw的超低功率VCSEL进行了电功率、光功率、温度和光谱研究。首先描述了尾纤的制造,其中VCSEL被粘合在陶瓷载体上,并通过前表面耦合连接到光纤上。从而利用折射率匹配胶粘剂和主动对准技术实现了光纤芯片的耦合。最后对表征结果进行分析,找出最佳运行条件。并给出了一种普通VCSEL的比较结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Packaging and characterisation of ultra low power VCSEL for sensor networks
In this paper an ultra-low power VCSEL with an electrical consumption of below 5 mW is characterised to electrical power, optical power, temperature as well as a spectral investigation. First the pigtail manufacture is described, where amongst others the VCSEL is bonded on a ceramic carrier and connected to an optical fibre by front surface coupling. Thereby the fibre-chip coupling is realised by using index matching adhesive as well as active alignment. Finally the results of the characterisation are analysed to find optimal operation conditions. For comparison results of a common VCSEL are shown.
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