Band1锯双工器的仿真设计

Qiu-Qun Tong, Ya-li Zou, Yuan-Dong Gu
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引用次数: 0

摘要

本文介绍了一种小体积、低插入损耗、高隔离的Band1 SAW双工器的设计与仿真。与主流Band1 SAW双工器(例如Murata SAYEY1G95HA0F0A)相比,我们的仿真结果表明,该设计使封装尺寸减小了约25%,长度和宽度分别缩短了200微米。该设计具有类似的1.8dB插入损耗和卓越的60dB隔离。通过对PCB层和主电路结构的迭代优化,成功地解决了封装尺寸减小引起的内部电磁耦合对性能的影响。这种紧凑的Band1 SAW双工器设计有潜力满足未来移动设备对射频通信越来越严格的尺寸要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Simulation Design of Band1 Saw Duplexer
This paper describes the design and simulation of a small volume, low insertion loss, and high isolation Band1 SAW duplexer. Compared to mainstream Band1 SAW Duplexer, for example Murata SAYEY1G95HA0F0A, our simulation results show that the design enables a package size reduction of ~25%, with the length and width shortened by 200 microns respectively. The design has a similar 1.8dB insertion loss and a superior 60dB isolation. Exacerbation of internal electromagnetic coupling on the performance caused by the reduction of package size is successfully resolved with iterative optimization of the PCB layer and main circuit structure. This compact Band1 SAW duplexer design has the potential to meet the more and more stringent size requirement of radio frequency communication in future mobile devices.
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