板测试覆盖率:数值预测和数值如何比较

W. Rijckaert, F. Jong
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引用次数: 8

摘要

电路板组件的测试覆盖率预测在测试工程、测试成本建模、测试策略定义和产品质量评估等方面具有重要的作用。引入一种定义如何计算覆盖率的方法可以增加整个电子行业的这种预测的价值。我们考虑了三个方面来计算测试覆盖率:故障建模、每故障覆盖率和总覆盖率。引入了故障类别的抽象级别,称为MPS(材料、放置、焊接),它使我们能够使用不同的故障模型来比较覆盖结果。此外,还讨论了基于规则的故障覆盖估计和加权覆盖计算。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Board test coverage: the value of prediction and how to compare numbers
Test coverage prediction for board-assemblies has an important function in, among others, test engineering, test cost modeling, test strategy definition and product quality estimation. Introducing a method that defines how this coverage is calculated can increase the value of such prediction across the electronics industry. We consider the three aspects to test coverage calculation: fault modeling, coverage per fault and total coverage. An abstraction level for fault categories is introduced, called MPS (material, placement, soldering) that enables us to compare coverage results using different fault models. Additionally, the rule based fault coverage estimation and the weighted coverage calculation are discussed.
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