Jiajia Fu, Haizhong Xie, H. Cao, Lixia Zhao, Xuejiao Sun, Baojun Sun, Junxi Wang, Jinmin Li
{"title":"不同电路板对led的热光学性能的比较分析","authors":"Jiajia Fu, Haizhong Xie, H. Cao, Lixia Zhao, Xuejiao Sun, Baojun Sun, Junxi Wang, Jinmin Li","doi":"10.1109/SSLCHINA.2015.7360695","DOIUrl":null,"url":null,"abstract":"We have fabricated three types of high power LEDs with different circuit boards: Al2O3 ceramic board, epoxy PCB with Cu-deposited on the wall of holes and epoxy PCB with Cu-filled through holes. The different contribution of the package have been separated and investigated by using the derivative of temperature rise in the time domain and thermal transient method. The results show that although the thermal conductivity coefficient of epoxy PCB is much smaller than that of ceramic, PCB integrated with Cu can improve the heat-dissipation significantly and decrease the thermal resistance. In addition, this design can also improve the EQE droop effect.","PeriodicalId":331882,"journal":{"name":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Comparative analysis of thermal and optical properties for the LEDs with different circuit boards\",\"authors\":\"Jiajia Fu, Haizhong Xie, H. Cao, Lixia Zhao, Xuejiao Sun, Baojun Sun, Junxi Wang, Jinmin Li\",\"doi\":\"10.1109/SSLCHINA.2015.7360695\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have fabricated three types of high power LEDs with different circuit boards: Al2O3 ceramic board, epoxy PCB with Cu-deposited on the wall of holes and epoxy PCB with Cu-filled through holes. The different contribution of the package have been separated and investigated by using the derivative of temperature rise in the time domain and thermal transient method. The results show that although the thermal conductivity coefficient of epoxy PCB is much smaller than that of ceramic, PCB integrated with Cu can improve the heat-dissipation significantly and decrease the thermal resistance. In addition, this design can also improve the EQE droop effect.\",\"PeriodicalId\":331882,\"journal\":{\"name\":\"2015 12th China International Forum on Solid State Lighting (SSLCHINA)\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 12th China International Forum on Solid State Lighting (SSLCHINA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SSLCHINA.2015.7360695\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLCHINA.2015.7360695","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparative analysis of thermal and optical properties for the LEDs with different circuit boards
We have fabricated three types of high power LEDs with different circuit boards: Al2O3 ceramic board, epoxy PCB with Cu-deposited on the wall of holes and epoxy PCB with Cu-filled through holes. The different contribution of the package have been separated and investigated by using the derivative of temperature rise in the time domain and thermal transient method. The results show that although the thermal conductivity coefficient of epoxy PCB is much smaller than that of ceramic, PCB integrated with Cu can improve the heat-dissipation significantly and decrease the thermal resistance. In addition, this design can also improve the EQE droop effect.
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