{"title":"力矩系统密集法的无迭代快速多层求解器","authors":"D. Gope, V. Jandhyala","doi":"10.1109/EPEP.2001.967640","DOIUrl":null,"url":null,"abstract":"A fast multilevel direct solver for the method of moments applied to electrically small structures is presented. The approach is based on a combination of low-rank decompositions and fill-in control. It is particularly advantageous for multiple right-hand-side problems such as those encountered in digital circuit and IC analyses, as is demonstrated by numerical simulation results presented.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"An iteration-free fast multilevel solver for dense method of moment systems\",\"authors\":\"D. Gope, V. Jandhyala\",\"doi\":\"10.1109/EPEP.2001.967640\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A fast multilevel direct solver for the method of moments applied to electrically small structures is presented. The approach is based on a combination of low-rank decompositions and fill-in control. It is particularly advantageous for multiple right-hand-side problems such as those encountered in digital circuit and IC analyses, as is demonstrated by numerical simulation results presented.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967640\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967640","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An iteration-free fast multilevel solver for dense method of moment systems
A fast multilevel direct solver for the method of moments applied to electrically small structures is presented. The approach is based on a combination of low-rank decompositions and fill-in control. It is particularly advantageous for multiple right-hand-side problems such as those encountered in digital circuit and IC analyses, as is demonstrated by numerical simulation results presented.