在薄硅上生长晶体氧化硅的证据

E. Cho, M. Green, J. Xia, R. Corkish
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引用次数: 2

摘要

绝缘体上硅(SOI)衬底的热氧化证明,在热氧化的SiO/sub /-Si界面上存在有序的氧化硅结构。用透射电镜(TEM)观察了用热SiO/sub /包裹厚度小于3nm的单晶Si薄膜样品中氧化硅的有序结构。通过TEM测量,有序氧化硅沿Si结构[110]方向的环间距为1.9 A/spl,沿Si结构(100)方向的环厚度为17 A/spl。它的存在可能与硅层非常薄有关,这可能会影响它们的柔韧性等因素,因为在我们的硅层厚度大于3nm的样品上没有观察到有序的氧化相。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evidence for crystalline silicon oxide growth on thin silicon
Thermal oxidation of a silicon-on-insulator (SOI) substrate gives evidence that an ordered silicon oxide structure exists on the upper, thermally oxidised SiO/sub 2/-Si interface. The ordered structure of silicon oxide was observed by transmission electron microscopy (TEM) in samples of thin monocrystalline Si film less than 3 nm thick encased by thermal SiO/sub 2/. Based on TEM measurement, the ordered silicon oxide has 1.9 A/spl ring/ spacing along the [110] direction of the Si structure and 17 A/spl ring/ thickness along the (100) direction of the Si structure. Its existence may be related to the fact that the silicon layers were very thin, which may have influenced factors such as their pliancy, since ordered oxide phases were not observed on our samples with silicon layers thicker than 3 nm.
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