SoC时代依赖于应用的扩展权衡和优化

Carlos H. Diaz, Mi-Chang Chang, Tong-Chern Ong, Jack Yuan-Chen Sun
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引用次数: 0

摘要

在高尺度CMOS技术中,一些物理现象已经成为影响晶体管电学特性的一阶因素。诸如STI机械应力、栅极电介质中的直接隧道效应、栅极线边缘粗糙度等影响对器件特性有显著影响。本文详细阐述了这些影响,以举例说明电路设计和工艺开发团队之间需要更密切的互动,以推动依赖于应用的缩放限制。本文还强调了在电路级器件建模领域进一步努力的必要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Application-dependent scaling tradeoffs and optimization in the SoC era
Several physical phenomena in highly scaled CMOS technology have now become first order elements affecting electrical behavior of transistor characteristics. Effects such as STI mechanical stress, direct tunneling in gate dielectrics, gate line-edge roughness, and others, have significant influence on device characteristics. This paper elaborates on these effects to exemplify the need for closer interaction between circuit design and process development teams in order to push out application-dependent scaling limits. The paper also highlights the need for further efforts in the areas of circuit-level device modeling.
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