Y. Arai, H. Takahara, K. Koyabu, S. Fujita, Y. Akahori, J. Nishikido
{"title":"用于异步传输模式交换系统的多千兆多通道光互连模块","authors":"Y. Arai, H. Takahara, K. Koyabu, S. Fujita, Y. Akahori, J. Nishikido","doi":"10.1109/ECTC.1993.346754","DOIUrl":null,"url":null,"abstract":"2.8-Gbit/s, 3-channel optical transmitter and receiver modules have been developed for board-to-board interconnection in Asynchronous Transfer Mode (ATM) switching systems. These modules are constructed with optical and electrical submodules. The optical submodule mainly consists of a multimode-fiber array and an optical device array. The electrical submodule is constructed by using multichip module technology with GaAs ICs and multilayer ceramic substrates. These submodules are independently assembled after they are tested. Over a wide range of temperatures, error-free 250-m transmission is successfully demonstrated without automatic power-control and automatic temperature control circuits in the transmitter module.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Multigigabit multichannel optical interconnection modules for asynchronous transfer mode switching systems\",\"authors\":\"Y. Arai, H. Takahara, K. Koyabu, S. Fujita, Y. Akahori, J. Nishikido\",\"doi\":\"10.1109/ECTC.1993.346754\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"2.8-Gbit/s, 3-channel optical transmitter and receiver modules have been developed for board-to-board interconnection in Asynchronous Transfer Mode (ATM) switching systems. These modules are constructed with optical and electrical submodules. The optical submodule mainly consists of a multimode-fiber array and an optical device array. The electrical submodule is constructed by using multichip module technology with GaAs ICs and multilayer ceramic substrates. These submodules are independently assembled after they are tested. Over a wide range of temperatures, error-free 250-m transmission is successfully demonstrated without automatic power-control and automatic temperature control circuits in the transmitter module.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"63 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346754\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multigigabit multichannel optical interconnection modules for asynchronous transfer mode switching systems
2.8-Gbit/s, 3-channel optical transmitter and receiver modules have been developed for board-to-board interconnection in Asynchronous Transfer Mode (ATM) switching systems. These modules are constructed with optical and electrical submodules. The optical submodule mainly consists of a multimode-fiber array and an optical device array. The electrical submodule is constructed by using multichip module technology with GaAs ICs and multilayer ceramic substrates. These submodules are independently assembled after they are tested. Over a wide range of temperatures, error-free 250-m transmission is successfully demonstrated without automatic power-control and automatic temperature control circuits in the transmitter module.<>