F. Iacopi, S. Brongersma, A. Mazurenko, H. Struyf, G. Mannaert, Y. Travaly, A. Maznev, T. Abell, J. Tower, K. Maex
{"title":"表面声波作为一种在线检测低k介质加工损伤的技术","authors":"F. Iacopi, S. Brongersma, A. Mazurenko, H. Struyf, G. Mannaert, Y. Travaly, A. Maznev, T. Abell, J. Tower, K. Maex","doi":"10.1109/IITC.2005.1499988","DOIUrl":null,"url":null,"abstract":"A surface acoustic wave technique was successfully applied for monitoring modification/damage of low-k dielectrics resulting from plasma-based patterning in a non-destructive and non-contact fashion. It is shown that this technique can be used to assess and compare dielectric damage, due to different processing conditions, in patterned structures.","PeriodicalId":156268,"journal":{"name":"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Surface acoustic waves as a technique for in-line detection of processing damage to low-k dielectrics\",\"authors\":\"F. Iacopi, S. Brongersma, A. Mazurenko, H. Struyf, G. Mannaert, Y. Travaly, A. Maznev, T. Abell, J. Tower, K. Maex\",\"doi\":\"10.1109/IITC.2005.1499988\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A surface acoustic wave technique was successfully applied for monitoring modification/damage of low-k dielectrics resulting from plasma-based patterning in a non-destructive and non-contact fashion. It is shown that this technique can be used to assess and compare dielectric damage, due to different processing conditions, in patterned structures.\",\"PeriodicalId\":156268,\"journal\":{\"name\":\"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.\",\"volume\":\"72 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2005.1499988\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2005.1499988","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Surface acoustic waves as a technique for in-line detection of processing damage to low-k dielectrics
A surface acoustic wave technique was successfully applied for monitoring modification/damage of low-k dielectrics resulting from plasma-based patterning in a non-destructive and non-contact fashion. It is shown that this technique can be used to assess and compare dielectric damage, due to different processing conditions, in patterned structures.