{"title":"损耗硅衬底上单片和耦合片上互连的等效电路建模","authors":"Ji Zheng, Y. Hahm, A. Weisshaar, V. K. Tripathi","doi":"10.1109/EPEP.1999.819222","DOIUrl":null,"url":null,"abstract":"A CAD-oriented modeling approach for on-chip interconnects on lossy silicon substrates is presented. The frequency-dependent line parameters for single and coupled interconnects are obtained by a modified spectral domain approach that takes into account both the shunt and longitudinal substrate currents. Equivalent circuit models with ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE-compatible models is in excellent agreement with the frequency-dependent characteristics of the interconnects.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate\",\"authors\":\"Ji Zheng, Y. Hahm, A. Weisshaar, V. K. Tripathi\",\"doi\":\"10.1109/EPEP.1999.819222\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A CAD-oriented modeling approach for on-chip interconnects on lossy silicon substrates is presented. The frequency-dependent line parameters for single and coupled interconnects are obtained by a modified spectral domain approach that takes into account both the shunt and longitudinal substrate currents. Equivalent circuit models with ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE-compatible models is in excellent agreement with the frequency-dependent characteristics of the interconnects.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"73 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819222\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819222","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate
A CAD-oriented modeling approach for on-chip interconnects on lossy silicon substrates is presented. The frequency-dependent line parameters for single and coupled interconnects are obtained by a modified spectral domain approach that takes into account both the shunt and longitudinal substrate currents. Equivalent circuit models with ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE-compatible models is in excellent agreement with the frequency-dependent characteristics of the interconnects.