高密度cmos多芯片模块测试与诊断

1991, Proceedings. International Test Conference Pub Date : 1991-10-26 DOI:10.1109/TEST.1991.519715

R.W. Bassett, P. S. Gillis, John J. Shushereba

{"title":"高密度cmos多芯片模块测试与诊断","authors":"R.W. Bassett, P. S. Gillis, John J. Shushereba","doi":"10.1109/TEST.1991.519715","DOIUrl":null,"url":null,"abstract":"Muhichip-module ( M C M ) packages have been developed for use with high-density, high-performance CMOS chip technologies. The combination of CMOS and multichip packaging poses, new test-related challenges arising from the resulting v e 9 large circuit and signal inputloutput counts, and from CMOS-related reliability requirements. This paper discusses current practice and indicates jidture directions for MCM assembly, testing, and diagnosis.","PeriodicalId":272630,"journal":{"name":"1991, Proceedings. International Test Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":"{\"title\":\"HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS\",\"authors\":\"R.W. Bassett, P. S. Gillis, John J. Shushereba\",\"doi\":\"10.1109/TEST.1991.519715\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Muhichip-module ( M C M ) packages have been developed for use with high-density, high-performance CMOS chip technologies. The combination of CMOS and multichip packaging poses, new test-related challenges arising from the resulting v e 9 large circuit and signal inputloutput counts, and from CMOS-related reliability requirements. This paper discusses current practice and indicates jidture directions for MCM assembly, testing, and diagnosis.\",\"PeriodicalId\":272630,\"journal\":{\"name\":\"1991, Proceedings. International Test Conference\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-10-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"19\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1991, Proceedings. International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1991.519715\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1991, Proceedings. International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1991.519715","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 19

摘要

多芯片模块(mcm)封装已开发用于高密度，高性能CMOS芯片技术。CMOS和多芯片封装的结合带来了新的测试相关挑战，这些挑战来自于由此产生的9个大电路和信号输入输出计数，以及CMOS相关的可靠性要求。本文讨论了目前的实践，并指出了MCM装配、测试和诊断的发展方向。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS

Muhichip-module ( M C M ) packages have been developed for use with high-density, high-performance CMOS chip technologies. The combination of CMOS and multichip packaging poses, new test-related challenges arising from the resulting v e 9 large circuit and signal inputloutput counts, and from CMOS-related reliability requirements. This paper discusses current practice and indicates jidture directions for MCM assembly, testing, and diagnosis.

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来源期刊

1991, Proceedings. International Test Conference

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