Young Sun, Mark Zhang, Jossen Yu, W. Dong, W. Chien
{"title":"提高NAND闪存持久性能的奇/偶字行失效分析","authors":"Young Sun, Mark Zhang, Jossen Yu, W. Dong, W. Chien","doi":"10.1109/IPFA.2009.5232715","DOIUrl":null,"url":null,"abstract":"A full-flow failure analysis (FA) was introduced in this paper. From the FA, we resolved odd/ even word-line failure which lead to poor endurance performance of a NAND Flash. After removing this defect, the endurance performance of this NAND Flash is greatly enhanced.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"8 Pt 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Failure analysis of odd/even word-line failure to improve the endurance performance of a NAND Flash\",\"authors\":\"Young Sun, Mark Zhang, Jossen Yu, W. Dong, W. Chien\",\"doi\":\"10.1109/IPFA.2009.5232715\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A full-flow failure analysis (FA) was introduced in this paper. From the FA, we resolved odd/ even word-line failure which lead to poor endurance performance of a NAND Flash. After removing this defect, the endurance performance of this NAND Flash is greatly enhanced.\",\"PeriodicalId\":210619,\"journal\":{\"name\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"8 Pt 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2009.5232715\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232715","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failure analysis of odd/even word-line failure to improve the endurance performance of a NAND Flash
A full-flow failure analysis (FA) was introduced in this paper. From the FA, we resolved odd/ even word-line failure which lead to poor endurance performance of a NAND Flash. After removing this defect, the endurance performance of this NAND Flash is greatly enhanced.