等离子体过程引起的充电损伤对高k MOSFET性能的影响

K. Eriguchi, M. Kamei, Y. Takao, K. Ono
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引用次数: 5

摘要

我们讨论了高k栅极介质的等离子体充电损伤(PCD),特别是金属氧化物半导体场效应晶体管(mosfet)中的阈值电压移位(ΔVth)。重点研究了天线效应引起的PCD,并估计了不同等离子体工艺处理的mosfet的ΔVth及其变化。在损坏的高k mosfet中,阈值电压移动的方向取决于损坏的量,即极性本身随着充电损伤的变化而导致“负”或“正”。我们展示了一个基于ΔVth对天线比r(=暴露的金属互连面积/栅极面积)的幂律依赖性和从大规模集成电路中的互连长度分布函数(ILDF)推导出的r分布的模型预测。然后,我们模拟ΔVth [σ(ΔVth)]的变化。PCD到高k介电体可能导致相当大的贡献mosfet参数波动。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-k MOSFET performance degradation by plasma process-induced charging damage — Impacts on device parameter variation
We discuss plasma charging damage (PCD) to high-k gate dielectrics, in particular, the threshold voltage shift (ΔVth) in metal-oxide-semiconductor field-effect transistors (MOSFETs). The PCD induced by the antenna effect is focused on, and ΔVth and its variation are estimated for MOSFETs treated by various plasma processes. The direction of threshold voltage shift in damaged high-k MOSFETs was found to depend on the amount of damage, i.e., the polarity itself results in "negative" or "positive" as the charging damage varies. We demonstrate a model prediction based on both the power-law dependence of ΔVth on the antenna ratio r (= exposed metal interconnect area/gate area) and the r distribution deduced from an interconnect-length distribution function (ILDF) in a large-scale integrated (LSI) circuit. Then, we simulate the variation in ΔVth [σ(ΔVth)]. PCD to high-k dielectrics may lead to a considerable contribution to MOSFET-parameter fluctuations.
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