硅衬底上MOCVD生长的AlGaN/GaN hemt的迁移率增强

S. L. Selvaraj, A. Watanabe, T. Egawa
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引用次数: 5

摘要

在硅衬底上生长和优化AlGaN/GaN晶体管是超越GaN、SiC和蓝宝石等成本效益衬底的重要研究课题。在正在进行的硅基GaN器件的研究中,我们已经实现了由MOCVD生长的AlGaN/GaN hemt的3215 cm2/Vs的高室温迁移率(μRT)。我们提高迁移率的方法包括(i)通过在Si上使用厚缓冲层来降低位错密度,(ii)使用1.5 nm的AlN间隔层。这是迄今为止报道的在GaN、SiC和蓝宝石衬底上生长的AlGaN/GaN的最高μRT。本文介绍了这些具有高迁移率的hemt的生长和器件特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhanced mobility for MOCVD grown AlGaN/GaN HEMTs on Si substrate
Growth and optimization of AlGaN/GaN transistors on Si substrate is an important subject of investigation to surpass the cost effective substrates like GaN, SiC and sapphire. In the ongoing study of GaN devices on Si, we have achieved record high room temperature mobility (μRT) of 3215 cm2/Vs for AlGaN/GaN HEMTs grown by MOCVD. Our approach to increase the mobility involves (i) reducing dislocation density by using thick buffer on Si and (ii) using 1.5 nm AlN spacer. This is the highest μRT so far reported for AlGaN/GaN grown on GaN, SiC and sapphire substrates. The growth and device characteristics of these HEMTs which have high mobility are presented in this report.
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