耐电晕聚酰亚胺/二氧化硅和氧化铝杂化膜的合成与表征

Proceedings Electrical Insulation Conference and Electrical Manufacturing Expo, 2005. Pub Date : 1900-01-01 DOI:10.1109/EEIC.2005.1566284

Hong Zhou, Yong Fan, Q. Lei

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引用次数: 0

摘要

采用溶胶-凝胶反应合成了一种新型的含有不同量二氧化硅和氧化铝的聚酰亚胺杂化膜，并对其进行了表征。以异丙基氧化铝和四乙氧基硅烷(TEOS)为原料，在N,N'-二甲基乙酰胺(DMAc)的聚酰胺(PAA)溶液中水解缩聚，加热至350℃，制备了杂化膜。利用傅里叶红外光谱(FTIR)和原子力显微镜(AFM)对复合膜的化学结构和表面形貌进行了表征。在Perkin-Elmer TGA7上测试了复合膜的热稳定性。纳米级无机氧化物的加入提高了杂化膜的热稳定性。二氧化硅和氧化铝的存在对聚酰亚胺薄膜的性能有显著影响

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Synthesis and characterization of corona-resistant polyimide/silica and alumina hybrid films

A new class of polyimide hybrid films with various amounts of silica and alumina has been synthesized by the sol-gel reaction and characterized. The hybrid films were obtained by the hydrolysis and polycondensation of heteropropyl-alumina and tetraethoxysilane (TEOS) in a polyamic acid (PAA) solution of N,N'-dimethylacetamide (DMAc), followed by heating to 350degC. The chemical structure and surface morphology of the composites films were characterized by Fourier transform infrared spectroscopy (FTIR) and atomic force microscopy (AFM). The thermal stability of the composite films was tested on a Perkin-Elmer TGA7. Thermal stability of the hybrid film was increased with the nano scale inorganic oxides. The presence of silica and alumina has a significant effect on the properties of polyimide films

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Proceedings Electrical Insulation Conference and Electrical Manufacturing Expo, 2005.

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