盖子粘接失效的根本原因研究

M. Ong, X. Zhao, B. Zee, P. P. Joman, J. Chin, R. Master
{"title":"盖子粘接失效的根本原因研究","authors":"M. Ong, X. Zhao, B. Zee, P. P. Joman, J. Chin, R. Master","doi":"10.1109/IEMT.2008.5507812","DOIUrl":null,"url":null,"abstract":"This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Root cause study on lid adhesion failure\",\"authors\":\"M. Ong, X. Zhao, B. Zee, P. P. Joman, J. Chin, R. Master\",\"doi\":\"10.1109/IEMT.2008.5507812\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.\",\"PeriodicalId\":151085,\"journal\":{\"name\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2008.5507812\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2008.5507812","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文研究了引起盖子与胶粘剂粘结失效的因素。结合FTIR和XPS对盖子表面行为的分析,对胶粘剂的固化机理进行了实验研究。结果表明,低水洗流量造成的杯盖表面残留会影响固化条件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Root cause study on lid adhesion failure
This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信