用于红外应用的块蚀刻表面微加工和倒装芯片集成微镜阵列

A. Tuantranont, L. Liew, V. Bright, Jianglong Zhang, Wenge Zhang, Y.C. Lee
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引用次数: 17

摘要

二维纯相位微镜阵列是一种很有前途的微系统,在光束导向、光学数据互连、实时图像识别、光谱学和像差校正等方面有着广泛的应用。为了调制红外波长的光,需要微镜有较大的偏转。在先前的活塞微镜研究中,表面微加工被用于制造平行板结构,镜与底层地址电极之间的间隙很窄,不足以调制比可见光谱更长的波长的光。本文采用表面微加工与本体微加工相结合的新技术,通过本体蚀刻的MUMPS表面微加工实现红外微镜阵列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bulk-etched surface micromachined and flip-chip integrated micromirror array for infrared applications
The 2-dimensional phase-only micromirror array is a promising microsystem that leads to many applications such as optical beam steering, optical data interconnects, real-time image recognition, optical spectroscopy, and aberration correction. Large deflection of micromirror is required to be able to modulate light in infrared wavelength. In previous works on piston micromirrors, surface micromachining was used to fabricate parallel plate structures with a narrow gap between the mirror and underlying address electrode, that is not adequate to modulate light in longer wavelength than in visible spectrum. In this paper, a novel technique that combines the surface and bulk micromachining was used to implement the infrared micromirror array through a bulk-etched MUMPS surface micromachining.
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