{"title":"四Asic Mcm-c，“Kiss”原理和下一代硅","authors":"E. Fulcher, S. Patil","doi":"10.1109/ICMCM.1994.753608","DOIUrl":null,"url":null,"abstract":"A ceramic MCM was designed and put into volume production. Four identical 15MM per side ASIC devices with 370 bond pads each are wirebonded into a four cavity, cofired, alumina PGA with 383 pins. All materials and processes were selected following the \"KISS' (Keep It Super Simple) principle in order to minimize risk and. insure meeting schedule requirements. The results are smaller size, better electrical performance and lower cost than four single chip CPGAs.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A Four Asic Mcm-c, the \\\"Kiss\\\" Principle, and the Next Generation Silicon\",\"authors\":\"E. Fulcher, S. Patil\",\"doi\":\"10.1109/ICMCM.1994.753608\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A ceramic MCM was designed and put into volume production. Four identical 15MM per side ASIC devices with 370 bond pads each are wirebonded into a four cavity, cofired, alumina PGA with 383 pins. All materials and processes were selected following the \\\"KISS' (Keep It Super Simple) principle in order to minimize risk and. insure meeting schedule requirements. The results are smaller size, better electrical performance and lower cost than four single chip CPGAs.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"118 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753608\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753608","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
摘要
设计了一种陶瓷MCM，并进行了批量生产。四个相同的每侧15MM的ASIC器件，每个都有370个键垫，通过导线连接到四个腔，共烧，氧化铝PGA, 383个引脚。所有材料和工艺的选择都遵循“KISS”(Keep It Super Simple)原则，以最大限度地降低风险和成本。确保满足计划要求。与4个单片CPGAs相比，具有体积更小、电性能更好、成本更低的优点。
A Four Asic Mcm-c, the "Kiss" Principle, and the Next Generation Silicon
A ceramic MCM was designed and put into volume production. Four identical 15MM per side ASIC devices with 370 bond pads each are wirebonded into a four cavity, cofired, alumina PGA with 383 pins. All materials and processes were selected following the "KISS' (Keep It Super Simple) principle in order to minimize risk and. insure meeting schedule requirements. The results are smaller size, better electrical performance and lower cost than four single chip CPGAs.
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