来自非普遍记忆的普遍特征:未来的线索……

L. Perniola, G. Molas, G. Navarro, E. Nowak, V. Sousa, E. Vianello, B. De Salvo
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引用次数: 11

摘要

对通用存储器的探索已经进行了好几年,但就科学文献的结果而言,并没有宣布一种技术能够满足存储器层次结构的所有要求。闪存和DRAM占据了全球半导体存储市场95%以上的销量[1],但两者都无法相互替代。对于颠覆性的后端存储技术,如OxRAM、CBRAM、PCM和MRAM,似乎也是如此。本文讨论了适用于此类颠覆性技术的通用签名。最后对RRAM和PCM领域的两个案例进行了具体分析,其中可以根据具体应用进行调整。提前了解每种技术的利弊,可以节省宝贵的研发时间,从而加快产品上市时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Universal Signatures from Non-Universal Memories: Clues for the Future...
The quest for the universal memory has been pursued since several years, but as far results from scientific literature do not declare one single technology able to fit all the requirements of the memory hierarchy. Flash and DRAM cover more than 95% of the global sales in the semiconductor memory market [1], but none of the two is able to substitute the other. This appears to be true also for disruptive backend memory technologies, like OxRAM, CBRAM, PCM and MRAM. This paper deals with universal signatures that stand true for such disruptive technologies. A specific analysis on two case examples from the RRAM and the PCM domain, where tradeoffs can be adjusted to target specific applications, is finally proposed. Knowing in advance the tradeoffs of each technology allows us to save precious time in research and development and therefore to accelerate the time-to-market.
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