隧道晶体管与电路协同设计在设计可靠的节能计算逻辑门中的应用

Sadulla Shaik, K. Krishna, R. Vaddi
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引用次数: 5

摘要

隧道场效应管的节能设计近年来备受关注。本文介绍了基于隧道场效应管(ttfet)的可靠异或逻辑门的设计、分析和基准测试,并采用电路协同设计,用于缩放电源电压(0.1-0.3V)下的节能计算。一种特殊的TFET的变体。我们已经探索了同结TFET(源极和漏极掺杂相同的InGaAs材料),并在电路级提出了三种异或栅极拓扑,如12T, 8T和6T。为了进行基准测试,所有设计都采用了20nm双栅极FinFET技术。在FinFET设计中,已经证明12T设计更健壮和可靠(就全摆幅而言),能效较低,6T设计最节能,但可靠性降低。我们证明了ttfet的陡坡特性使12T设计成为节能的选择,同时提高了可靠性,而在0.1V VDD的所有设计中,6T设计在能效和可靠性方面是最好的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Tunnel transistors with circuit co-design in designing reliable logic gates for energy efficient computing
Tunnel FETs have attracted much attention recently for energy efficient designs. This paper presents design, analysis and benchmarking of Tunnel FET (TFET) based reliable XOR logic gates with circuit co-design for energy efficient computing at scaled supply voltages (0.1-0.3V). A specific variant of TFET ie., homo-junction TFET (where source and drain are doped with same material InGaAs) has been explored and at the circuit level three XOR gate topologies such as 12T, 8T and 6T have been proposed. For benchmarking, 20nm double-gate FinFET technology has been used for all the designs. In FinFET designs, it has been demonstrated that 12T design is more robust and reliable (in terms of full swing) and less energy efficient and 6T design is most energy efficient, but reduced reliability. We demonstrate that TFET's' steep slope characteristics enable the 12T design to be energy efficient option along with improved reliability and 6T design is the best in terms of energy efficiency and reliability amongst all designs at 0.1V VDD.
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