PIND测试失败的SEM/EDAX分析

J. F. D. Porto, D. Loescher, H. Olson, P. Plunkett
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引用次数: 2

摘要

用于高可靠性军事和空间应用的封装LSI和混合器件必须通过Mil标准883B方法5004定义的一系列严格的筛选。其中一个屏幕是粒子冲击噪声检测(PIND)测试。该测试使用一个非常灵敏的声学换能器,在包装受到振动和冲击时,聆听包装内的颗粒。我们使用SEM, EDAX和光学显微镜来分析PIND失效的颗粒。从这些分析中,我们已经确定了PIND失败的主要来源,并制定了在PIND测试中产生低废品率的程序。本研究中使用的器件是一个1k RAM芯片,共晶连接到一个24针无引线密封封装(LHP)。该包是焊料密封在带炉与金-锡共晶预铸和镀金盖。我们已经从PIND测试失败中恢复了颗粒,将铅带放在镀金科瓦尔盖的穿孔上。然后,包装被振动,直到颗粒穿过孔并附着在胶带上的粘合剂上。从分析中,我们已经确定了导致PIND测试失败的许多颗粒来源;主要来源是密封过程中使用的金锡焊料预制体。我们研究了密封材料、炉温、炉环境和封装方向对金锡焊料球数量的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SEM/EDAX Analysis of PIND Test Failures
Packaged LSI and hybrid devices used in high reliability military and space applications must pass a rigorous series of screens defined by Method 5004 of Mil Standard 883B. One of these screens is the Particle Impact Noise Detection (PIND) test. This test uses a very sensitive acoustic transducer to listen for particles within the package while the package is vibrated and shocked. We have used SEM, EDAX, and optical microscopy to analyze the particles from PIND failures. From these analyses we have identified the primary sources of PIND failures and have developed procedures that yield a low reject rate at PIND test. The device used in this investigation was a 1 K RAM die eutectically attached to a 24-pin leadless hermetic package (LHP). The package is solder sealed in a belt furnace with a gold-tin eutectic preform and a gold-plated cover. We have recovered the particles from PIND test failures by placing lead tape over a punched hole in the gold plated Kovar lid. The package is then vibrated until the particles pass through the hole and are attached to the adhesive on the tape. From the analyses we have identified many sources of particles that cause PIND test failures; the main source being the gold-tin solder preform used in the sealing process. We have investigated the effect of sealing materials, furnace temperature, furnace ambient, and package orientation on the number of gold-tin solder spheres.
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