非晶化砷化镓固相外延生长中衬底取向依赖性的原位和非原位透射电镜研究

K. Belay, M. Ridgway, D. Llewellyn
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引用次数: 0

摘要

利用原位透射电镜(TEM)和非原位透射电镜(ex-situ TEM)研究了衬底取向对非晶化砷化镓固相外延生长(SPEG)的影响。将As和Ga离子注入半绝缘(loo)、(1io)和(11i) GaAs衬底,形成了一层薄的非晶层。在26OOC的电镜下进行原位退火,研究衬底取向对非晶化GaAs的SPEG的影响。定量分析表明,非晶(a/c)-界面的非平面性在(1 1 1)衬底取向下最大。相反,对于(i10)衬底,a/c接口是平面的。测量了微孪晶相对于直流界面的角度,结果表明(i11)平面的角度最大。这与原位TEM结果一致,从而证实了(1 1 I)的a/c界面是最粗糙的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An in-situ and ex-situ transmission electron microscopy study of the substrate orientational dependence of the solid-phase epitaxial growth of amorphized GaAs
In-situ transmission electron microscopy (TEM) has been utilised in conjunction with conventional ex-situ TEM to study the influence of substrate orientation on the solidphase epitaxial growth (SPEG) of amorphized GaAs. A thin amorphous layer was produced by ion implantation of As and Ga ions into semi-insulating (loo), (1 IO) and (1 1 I ) GaAs substrates. In-situ annealing at 26OOC in the electron microscope was performed to study the influence of substrate orientation on the SPEG of amorphized GaAs. Quantitative analysis has demonstrated that the non-planarity of the amorphous-crystalline (a/c)-interface was greatest for the (1 1 1) substrate orientation. Conversely the a/c-interface is planar for the ( I 10) substrate. The angle of the microtwins with respect to the dc-interface was measured and it has been shown that the angle in the case of ( I 11) plane was largest. This is consistent with in-situ TEM results, and thus confirming that the a/c-interface for the (1 1 I ) is the roughest.
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