A. Papp, F. Bieringer, D. Koch, H. Kammer, A. Kohlhase, A. Lill, A. Preussger, A. Schlemm, M. Schneegans
{"title":"在生产线上实施wlr程序","authors":"A. Papp, F. Bieringer, D. Koch, H. Kammer, A. Kohlhase, A. Lill, A. Preussger, A. Schlemm, M. Schneegans","doi":"10.1109/IRWS.1995.493575","DOIUrl":null,"url":null,"abstract":"Describes the implementation of a process reliability monitoring program on the basis of wafer level tests into the control concept of a production line. For the main reliability parameters-gate oxide integrity, hot carrier injection immunity and metallization stability against electromigration-the methods, test structures, test conditions and results are presented. Some examples for reliability improvement and the future targets of the WLR-program are given.","PeriodicalId":355898,"journal":{"name":"IEEE 1995 International Integrated Reliability Workshop. Final Report","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Implementation of a WLR-program into a production line\",\"authors\":\"A. Papp, F. Bieringer, D. Koch, H. Kammer, A. Kohlhase, A. Lill, A. Preussger, A. Schlemm, M. Schneegans\",\"doi\":\"10.1109/IRWS.1995.493575\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Describes the implementation of a process reliability monitoring program on the basis of wafer level tests into the control concept of a production line. For the main reliability parameters-gate oxide integrity, hot carrier injection immunity and metallization stability against electromigration-the methods, test structures, test conditions and results are presented. Some examples for reliability improvement and the future targets of the WLR-program are given.\",\"PeriodicalId\":355898,\"journal\":{\"name\":\"IEEE 1995 International Integrated Reliability Workshop. Final Report\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 1995 International Integrated Reliability Workshop. Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.1995.493575\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1995 International Integrated Reliability Workshop. Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1995.493575","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Implementation of a WLR-program into a production line
Describes the implementation of a process reliability monitoring program on the basis of wafer level tests into the control concept of a production line. For the main reliability parameters-gate oxide integrity, hot carrier injection immunity and metallization stability against electromigration-the methods, test structures, test conditions and results are presented. Some examples for reliability improvement and the future targets of the WLR-program are given.