新型磁浮电火花加工技术制备微孔

Rajesh Sahoo, Deepak Kumar, N. K. Singh, Vivek Bajpai
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引用次数: 3

摘要

在目前的情况下,通过电火花加工(EDM)工艺进行微制造是实现任何产品所需的复杂微/纳米特征的重要技术。加工特征的精度和准确性是微细加工的前提。目前的工作旨在验证新型磁悬浮电火花加工在薄镍片(厚度= 500 μm)上制造微孔的可行性。通过与传统电火花加工工艺的比较,研究了新开发系统的可行性。为了克服传统电火花加工的缺点,将纯直流电源与基于磁悬浮的间隙监测机构组合在一起。这种新型装置利用永磁体的联合效应来减少电弧和短路。操作的控制参数为12v开路电压和2a峰值电流,同时保持占空因数为95.564%。测量的放电电压为6.64 V,放电电流为900 mA。实验以钨棒(ø 650 μm)为工具,以去离子水为介质。此外,利用高分辨率显微镜、扫描电镜和能量色散光谱报告对加工后的微孔和微刀具进行了分析。新开发的磁悬浮电火花加工在导电材料上产生微孔的可行性在本工作中得到了证实,平均材料去除率为40 μg/min。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of micro-hole using novel Maglev EDM
In the current scenario, micro-manufacturing through the electro-discharge machining (EDM) process is a prominent technique for achieving desired complex micro/nano-features of any product. The precision and accuracy of producing features are the prerequisites of micro-machining. The current work aims to check the feasibility of the novel Maglev EDM for fabricating micro-holes on a thin nickel sheet (thickness = 500 μm). The study presents the viability of the newly developed system by comparing it with the conventional EDM process. A pure direct current power supply is assembled with a magnetic levitation-based gap monitoring mechanism to overcome the setbacks of conventional EDM. The novel setup utilizes the combined effect of the permanent electromagnet to diminish arcing and short-circuiting. The control parameters for the operation were 12 V open-circuit voltage and 2 A peak current while maintaining a duty factor of 95.564 percent. The measured discharge voltage and discharge current were 6.64 V and 900 mA, respectively. Tungsten rod (ø 650 μm) and deionized water were used as a tool and a dielectric medium, respectively, for the experiment. Further, the machined micro-hole and micro-tool analysis have been carried out using high-resolution microscopy, scanning electron microscopy and energy dispersive spectroscopy reports. The newly developed Maglev EDM’s feasibility to produce micro-holes on conductive materials has been confirmed in the present work with an average material removal rate of 40 μg/min.
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