嵌入源场板结构的AlN/GaN miss - hemt的电子迁移率和自热建模

H. Aoki, N. Tsukiji, H. Sakairi, K. Chikamatsu, N. Kuroda, S. Shibuya, K. Kurihara, M. Higashino, H. Kobayashi, K. Nakahara
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引用次数: 4

摘要

基于嵌入式源场板结构,推导了AlN/GaN miss - hemt漏极电流模拟的电子迁移率和自热模型。它们是可伸缩的物理模型。为了将该模型应用于包括DC-DC变换器在内的功率开关应用,对线性特性的弱反转和最大漏极电流是重要的。这些模型是在MIT虚拟源模型中通过修改Verilog-A源代码实现的。模型参数提取自采用嵌入式源场极板技术制作的晶体管测试结构的测量数据。实验结果与模拟结果非常吻合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electron Mobility and Self-Heat Modeling of AlN/GaN MIS-HEMTs with Embedded Source Field-Plate Structures
Electron mobility and self-heating models for drain current simulations of AlN/GaN MIS-HEMTs have been derived for embedded source field-plate structures. They are scalable physical models. To apply the models to simulate power switching applications including DC-DC converters, the weak inversion to linear characteristics and the maximum drain current are important. The models are implemented in MIT Virtual Source model with modifications of Verilog-A source codes. The model parameters are extracted from measured data of the transistor test structures that we fabricated with an embedded source field-plate technology. The results show excellent agreements between measurements and simulations.
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