{"title":"LIGA技术-微结构的新概念，并结合硅技术的注射成型","authors":"W. Menz, W. Bacher, M. Harmening, Andreas Michel","doi":"10.1109/MEMSYS.1991.114771","DOIUrl":null,"url":null,"abstract":"The LIGA technique originally developed to fabricate separation nozzles for the enrichment of uranium has been expanded into a universal technology for the fabrication of microstructures with high aspect ratio and free lateral shaping. The LIGA process consists of three basic process steps: deep-etch lithography by means of synchrotron radiation, electroforming, and plastic molding. The choice of materials ranges from plastics (PMMA, POM, PA) to metals (up to now Au, Ni, Cu) and ceramics (ZrO/sub 2/). These microstructures can be mass-produced by inexpensive injection molding and reaction injection molding processes. Integration with Si technology/int is possible, opening up the potential of novel applications and improving both overall yield and package density.<<ETX>>","PeriodicalId":258054,"journal":{"name":"[1991] Proceedings. IEEE Micro Electro Mechanical Systems","volume":"399 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"93","resultStr":"{\"title\":\"The LIGA technique-A novel concept for microstructures and the combination with Si-technologies by injection molding\",\"authors\":\"W. Menz, W. Bacher, M. Harmening, Andreas Michel\",\"doi\":\"10.1109/MEMSYS.1991.114771\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The LIGA technique originally developed to fabricate separation nozzles for the enrichment of uranium has been expanded into a universal technology for the fabrication of microstructures with high aspect ratio and free lateral shaping. The LIGA process consists of three basic process steps: deep-etch lithography by means of synchrotron radiation, electroforming, and plastic molding. The choice of materials ranges from plastics (PMMA, POM, PA) to metals (up to now Au, Ni, Cu) and ceramics (ZrO/sub 2/). These microstructures can be mass-produced by inexpensive injection molding and reaction injection molding processes. Integration with Si technology/int is possible, opening up the potential of novel applications and improving both overall yield and package density.<<ETX>>\",\"PeriodicalId\":258054,\"journal\":{\"name\":\"[1991] Proceedings. IEEE Micro Electro Mechanical Systems\",\"volume\":\"399 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"93\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991] Proceedings. IEEE Micro Electro Mechanical Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.1991.114771\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991] Proceedings. IEEE Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1991.114771","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The LIGA technique-A novel concept for microstructures and the combination with Si-technologies by injection molding
The LIGA technique originally developed to fabricate separation nozzles for the enrichment of uranium has been expanded into a universal technology for the fabrication of microstructures with high aspect ratio and free lateral shaping. The LIGA process consists of three basic process steps: deep-etch lithography by means of synchrotron radiation, electroforming, and plastic molding. The choice of materials ranges from plastics (PMMA, POM, PA) to metals (up to now Au, Ni, Cu) and ceramics (ZrO/sub 2/). These microstructures can be mass-produced by inexpensive injection molding and reaction injection molding processes. Integration with Si technology/int is possible, opening up the potential of novel applications and improving both overall yield and package density.<>
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